With GlobalPoint PTP reflow trackers and software, recording and adjusting temperature profiles becomes child’s play. Interflux® DP 5505 solder paste is a low voiding solder paste. One was halogen-containing and the other was halogen-free. Both were Pb-free, containing SAC305 as the alloy. As mentioned at the beginning of this paper, two no-clean solder pastes were tested with these various reflow profiles. These solder pastes will, under the same conditions, show far fewer voids than standard solder pastes. Table 1 Compiled Reflow Profile Parameters. Solder pastes can be specially designed and formulated to reduce outgassing. Depending on the type of solder paste, this method has more or less effect. We recommend using the solder profile as given in Section 2.1 Solder reflow profile for soldering QFN packages. This allows the outgassing solder flux to escape without immediately becoming trapped in the liquid tin. A zone of constant temperature is then created below the melting temperature of the solder. The voiding can be avoided by adjusting the temperature profile. To reduce this problem, there are reflow ovens and vapour phase reflow systems on the market that generate a negative pressure or vacuum during the liquid phase, which ‘sucks’ the gas bubbles out. Especially in places under components it is extra difficult for the gases to escape because gases tend to move vertically. When these gas bubbles have not left the liquid tin they become trapped in the solidified mass during the solidification of the solder. The flux contains resins and solvents, among other things, which all gas out when heated. Solder paste consists of 2 main components, namely metal powder and flux. However, the main cause of these voids, which are in fact gas bubbles, is the solder paste used. After reaching 150C, the peak temperature should be. The cause of this phenomenon can be found in the outgassing of substances used in the various components, materials and PCBs. The RTS profile spike zone is the stage where the assembly reaches the solder reflow temperature. D:20050615183953 Acrobat PDFMaker 6.What is voiding and does the reflow profile affect it? VoidingĪ phenomenon that occurs in the reflow soldering process.īubbles (voids) begin to form in the flowed and solidified solder which make the solder joint hollow to a certain extent. 3 cycle Max.)/RD/Type/Annot/AP/BE>endobj147 0 objendobj148 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj149 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj150 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj151 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj152 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj153 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj154 0 objendobj155 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj156 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj157 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj159 0 obj/Type/XObject/BBox/FormType 1>streamĮndstreamendobj160 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj161 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj162 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj163 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj164 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj165 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj166 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj167 0 obj/ProcSet>/Type/XObject/BBox/FormType 1>streamĮndstreamendobj168 0 objendobj169 0 ~�^aڻx��R�o����B�ޫ�e��C�+��ӯ�e����bp��6 �ك�- �=bd�Ĺ�̚�Y��8�Є�yx��m�O�of���r�QY��+streamĪcrobat Distiller 6.0.1 (Windows) KOA Speer Electronics, Inc.
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